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The market for advanced packaging was valued at US$ 24.2 billion in 2020 and is anticipated to grow to US$ 52.75 billion by 2030, at a notable CAGR of 8.1%.
— Harold
SEATTLE, WASHINGTON, USA, December 10, 2022 /EINPresswire.com/ — Global Advanced Semiconductor Packaging Market Overview
In semiconductor packaging, the semiconductor chip is encased in a substrate on which an integrated circuit is created. Materials used in semiconductor packaging include ceramic packages, die attach materials, bonding wires, organic substrates, lead frames, and others.
In recent years, the need for advanced semiconductor packaging has increased significantly. The increased need for high-performance, low-power CPUs is to blame for this. Manufacturers can produce these chips more cheaply and efficiently by using advanced packaging.
Market Segment and Regional Analysis
Chip scale packages and lead frame packages are the two market segments for advanced semiconductor packaging. CSP rules the market thanks to its excellent performance and affordable price. Given its more expensive manufacturing processes and intricate structure, LFP is anticipated to expand at a comparatively slower rate.
In terms of sophisticated semiconductor packaging, sensor and MEMS applications dominate the world market. Due to their expanding use in a variety of end-use sectors, including the automobile, military, healthcare, and telecommunications, these applications are experiencing rapid expansion.
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historical data and forecast of the following regions are covered: North America (the US, Canada and Mexico), South America (Brazil, Argentina and Others), Europe (the UK, Germany, France, Italy, Spain and Others), APAC (China, Japan, South Korea, India, Australia and Others) and RoW (the Middle East and Africa).
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Prominent Key Players of the Advanced Semiconductor Packaging Market
• Advanced Semiconductor Engineering, Inc.
• Amkor Technology, Inc.
• ChipMOS Technologies Inc.
• FlipChip International LLC
• HANA Micron Inc.
• ISI – Interconnect Systems
• JCET Group
• King Yuan Electronics Co., Ltd.
• NEPES
• Powertech Technology Inc.
• Samsung
• Signetics
• Taiwan Semiconductor Manufacturing Company Limited
• Veeco Instruments Inc.
Key Market Segments Table: Global Advanced Semiconductor Packaging Market
Based on types, the Global Advanced Semiconductor Packaging Market
is primarily split into:
• Ball Grid Array
• Chip Scale Package
• Lead frame package
• Land Grid Array
• Pin Grid Array
• Others.
Based on applications, the Advanced Semiconductor Packaging Market
covers:
• NAND Devices
• DRAM
• Sensors
• MEMS
• LED and LCD display Drivers
• Central Processing Units
• Graphical Processing Units
• Others.
The Global Advanced Semiconductor Packaging market can be divided into regions based on geography including:
• North America (USA and Canada)
• Europe (UK, Germany, France and the rest of Europe)
• Asia Pacific (China, Japan, India, and the rest of the Asia Pacific region)
• Latin America (Brazil, Mexico, and the rest of Latin America)
• Middle East and Africa (GCC and rest of the Middle East and Africa)
Analysis of the impact of the Russia-Ukraine War and COVID-19
The Advanced Semiconductor Packaging (ASP) market has been significantly impacted by the Russia-Ukraine War and COVID-19. As a result, ASP businesses are finding it difficult to manage the scarcity of packaging supplies and equipment as well as rising production expenses. As a result, there has been a decrease in ASP demand, especially in Europe and Asia. The market is anticipated to rebound in the coming years, though, as a result of major players in the ASP sector increasing their investments.
Key Drivers & barriers in the Advanced Semiconductor Packaging Market
Increased demand for more sophisticated semiconductor goods, rising need for energy-efficient devices, and advancements in 3D printing technology are some major market drivers. If businesses want to join the market, there are a number of obstacles that must be removed. These include worries about consistency and security as well as difficulties with creating new packaging technologies.
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Key Benefits for Industry Participants & Stakeholders:
The following are some of the major advantages for industry participants and stakeholders: –
• Improved performance: By lowering heat emissions and enhancing signal integrity, advanced semiconductor packaging enhances the performance of
devices. This lowers the price of hardware while extending battery life.
• Reduced power consumption: By enhancing heat dissipation abilities, advanced semiconductor packaging minimizes power consumption. Electronic
gadget running costs are thereby decreased.
Following is the list of TOC for the Advanced Semiconductor Packaging Market
• Product Overview
• Scope of Market
• Market Segment by Type
• Global Market Size Growth Rate Analysis by Type
• Global Consumption Comparison by Application
• Global Market Growth Prospects
• Global Revenue Estimates and Forecasts (2017-2028)
• Global Market Size by Region
• Market Competition by Manufacturers
• Production by Region
• Market Segment by Type
• Market Segment by Application
• Key Companies Profiled
• Manufacturing Cost Analysis
• Marketing Channel, Distributors and Customers
• Market Dynamics
• Production and Supply Forecast
• Forecast by Type and by Application (2023-2028)
• Conclusion
Why is a Advanced Semiconductor Packaging Market Research Report so Important?
• The main companies in the market for advanced semiconductor packaging are discussed in the study to help readers better understand their current
competitive landscape and long-term plans.
• The study focuses on the market size, segment size, competitive environment, current situation, and development trends for advanced semiconductor
packaging.
• The report offers tactics for businesses to deal with COVID-19 threats.
• This report aids in obtaining insightful market analyses
Mahesh Patel
VIRTUOSE MARKET RESERACH PRIVATE LIMITED
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